1318139-1 datasheet

Маркировка

1318139-1
Производитель

TE Connectivity
Описание

TE Connectivity 1318139-1 Applies To: Printed Circuit Board Assembly Process Feature: None Backshell Plating: Matte Tin Contact Plating, Mating Area, Material: Gold Contact Plating, Mating Area, Thickness (?µm [??in]): 0.1 [3.937] Contact Termination Type: Through Hole Front Shell Plating: Matte Tin over Nickel Gender: Receptacle Housing Color: Black Lead Free Solder Processes: Wave solder capable to 240?°C, Wave solder capable to 260?°C, Wave solder capable to 265?°C Locating Post(s): Without Mount Location: Top Number Of Ports: 1 Number Of Positions: 4 Orientation: Right Angle Packaging Method: Tray Panel Ground: With Panel Ground Location: Top Panel Ground Type: 2.65 Hole Pcb Mount Retention Type: Straight and Kinked Leg Pcb Thickness (minimum) (mm [in]): 1.60 [0.063] Rohs/elv Compliance: RoHS compliant, ELV compliant Rohs/elv Compliance History: Converted to comply with RoHS directive Series: IEEE 1394a Size: Mini Tail Length (mm [in]): 3.2 [0.126] Termination Method: Solder
Количество страниц

13 шт.
Формат

PDF
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Размер файла

328,92 KB